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Laser processing×大船企業日本 - List of Manufacturers, Suppliers, Companies and Products

Laser processing Product List

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UV laser processing [High frequency / 5G compatible substrate processing]

UV laser processing [High frequency / 5G compatible substrate processing]

We are challenging the processing of new substrate materials compatible with high frequency, 5G, and automotive applications, with the cooperation of substrate material manufacturers and substrate manufacturing companies.

1. High-frequency and 5G compatible substrate processing ■No.1-1: Example of φ100um blind hole and through hole processing on fluororesin substrate (Rogers RO3003) ■No.1-2: Example of φ100um blind hole and through hole processing, as well as router processing on liquid crystal polymer substrate (Panasonic FELIOS LCP) ■No.1-3: Example of φ20um to φ50um blind hole processing on liquid crystal polymer substrate ■No.1-4: Example of φ150um blind hole processing on Panasonic R5515, MEGTRON6, and MEGTRON7 substrates

  • Circuit board processing machine

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UV laser processing [copper foil removal processing]

UV laser processing [copper foil removal processing]

■ Trepanning processing with a diameter of 25um or more is possible using a very small diameter beam. ■ Punching processing with a minimum diameter of 10um is possible only for thin copper foil.

3. Copper foil removal processing ■No.3-1: Example of punching processing with a diameter of φ10um to φ30um (t1.5um copper foil) ■No.3-2: Example of trepanning processing with a diameter of φ25um to φ100um (t5um copper foil)

  • Circuit board processing machine

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UV & CO2 composite laser processing

UV & CO2 composite laser processing

We are proposing a more reliable laser processing method that leverages the characteristics of both UV lasers and CO2 lasers.

6. UV & CO2 Composite Laser Processing ■ No. 6-1: Example of φ100um blind hole processing on fluororesin substrate (Rogers RO3003) ■ No. 6-2: Example of φ100um blind hole processing on Cu + prepreg substrate

  • Circuit board processing machine

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CO2 Laser Processing [Through-Hole Processing Results]

CO2 Laser Processing [Through-Hole Processing Results]

5G high-frequency compatible products, with APP memory and technologies for thinning and reducing the diameter of the core layer, using CO2 laser drilling techniques for TH holes.

TH (Through Hole) Processing Results ■No.1: Example of processing untreated substrate Cu direct board thickness 200μm 　　Hole diameter φ70μm ■No.2: Example of processing untreated substrate Cu direct thin board Board thickness 40μm to 100μm 　　 Hole diameter φ40μm to φ70μm

  • Circuit board processing machine

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UV laser processing [Direct processing of ABF material resin]

UV laser processing [Direct processing of ABF material resin]

■ It is possible to process ABF material blind holes with a high taper ratio and uniform hole bottom quality. ■ The minimum hole diameter is φ10um, allowing for control of processing quality.

2. Direct Processing of ABF Material Resin ■No.2-1: Example of blind hole processing with a diameter of φ10um to φ30um (t10um) ■No.2-2: Example of blind hole processing with a diameter of φ20um to φ40um (t25um) ■No.2-3: Example of square hole processing 20x20um, 30x30um, 40x40um, and 60x20um (t25um) ■No.2-4: Example of blind hole processing with a diameter of φ20um to φ50um, and an example of quality control for the bottom of φ50um blind holes (t23um)

  • Circuit board processing machine

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UV laser processing [Flexible substrate processing]

UV laser processing [Flexible substrate processing]

High-quality blind hole and through hole processing is possible by combining trepanning and punching. Router processing using ultra-small diameter beams is also possible.

4. Flexible substrate processing ■No.4-1: Example of blind hole processing for single-sided flexible substrates with diameters from φ20um to φ50um ■No.4-2: Example of blind hole processing for double-sided flexible substrates with diameters from φ25um to φ100um

  • Circuit board processing machine

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UV laser processing [Router (contour) processing]

UV laser processing [Router (contour) processing]

■High-quality cutting of multilayer substrates using ultra-small diameter beams is possible. ■Not only linear processing but also processing of irregular shapes including curves is possible.

5. Router (External Shape) Processing ■No.5-1: Example of irregular shape cutting processing of flexible printed circuit boards ■No.5-2: Example of cutting processing of Cu + prepreg multilayer boards

  • Circuit board processing machine

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CO2 Laser Processing [Cu Direct Blind Hole Processing Results]

CO2 Laser Processing [Cu Direct Blind Hole Processing Results]

Focus on the micro-diameter processing capability of CO2 lasers and the technology for controlling resin diameter.

1. Cu Direct BH Processing Results ■No.1: Example of untreated substrate Cu direct micro-diameter processing Hole diameter φ30–60μm ■No.2-1: Improvement in quality and productivity of Cu direct φ70μm processing ■No.2-2: Improvement in quality and productivity of Cu direct φ100μm processing

  • Circuit board processing machine

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CO2 Laser Processing [ABF Resin Direct Processing Results]

CO2 Laser Processing [ABF Resin Direct Processing Results]

■ The densification of package substrates is progressing, and there is a demand for miniaturization using CO2 lasers. ■ Introducing examples of miniaturization processing using our VELA machine.

ABF Resin Direct Processing Results ■No.1-1: Resin Direct (ABF GZ41 t32.5μm) Hole diameter φ30–50μm ■No.1-2: Resin Direct (ABF GZ41 t32.5μm) Hole diameter φ60–120μm ■No.2-1: Resin Direct (ABF Development Product t32.5μm) Hole diameter φ30–50μm ■No.2-2: Resin Direct (ABF Development Product t32.5μm) Hole diameter φ60–120μm

  • Circuit board processing machine

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